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　　元器件交易網(wǎng)訊 4月2日消息，據(jù)外媒報道，日月光半導體公司（ASE）計劃與華亞科技聯(lián)合成立合資公司，該公司主要對器件使用3D封裝TSV（高密度的硅穿孔）技術。

　　ASE和華亞科已經(jīng)談判有一年多，并預計很快進入進程，該合資企業(yè)很可能被設置在華亞科技的閑置廠房或日月光工廠中。兩家公司最初的生產(chǎn)目標是每月推出1萬片3D IC芯片，預計將擴大TSV封裝范圍，包括應用處理器和移動RAM芯片。（元器件交易網(wǎng)   白玉濤譯）

　　以下為外文：

　　在ASE-華亞科合資公司也有可能與臺灣半導體制造公司（TSMC）在3D IC封裝業(yè)競爭，該消息人士指出。Advanced Semiconductor Engineering (ASE) reportedly plans to team up with Inotera Memories to set up a joint venture for handling TSV (through-silicon via) 3D IC packaging.

　　ASE and Inotera have been in talks for over a year and are expected to finalize the deal soon, said the sources, adding that the joint venture is likely to be set up either at a Inotera's idle plant or at a ASE plant in Chungli, north Taiwan.

　　Initial production aims are to roll out 10,000 3D IC chips a month, said the sources, adding that the two firms are expected to expand the TSV packaging technology to include application processors and mobile RAM chips.

　　The ASE-Inotera joint venture is also likely to compete with Taiwan Semiconductor Manufacturing Company (TSMC) in the 3D IC packaging sector, the sources noted.